常常
微波通信元電子原件
RF/Microwave Evaluation Board
This high performance RF/MW evaluation board is for a 3-port device up to .050 x .050 size. Each board comes with three high performance end launch connectors that are easy to assemble. In addition, this board is solderable and wire bondable. A DC feed line is provided for biasing and a thru is also provided for quick de-embedding.
Highlights
- Measure: 0.50 x .050 Die/Chip
- High Performance DC-12.4 GHz
- Low Insertion Loss (0.7 dB @ 12.4 GHz)
- Low VSWR (1.20:1)
- 3x RF Ports / 2x DC Ports
- Wire Bondable and Solderable
- Thru Line for Quick De-embedding
- Includes 3x High Performance SMA